Surface roughness system 表面粗糙度儀

Measurement Material :Bare silicon wafer (etched, polished, thin , etc) / Coated silicon wafer

 Measurement Size 100,125,150,200 and 300 mm

 Measurement Thickness 100 um<

 Wafer Chuck Method Vacuum Chucking

 Rotary Stage: 
 Repeat ability +/- 0.01 deg
 Accuracy +/- 0.05 deg

 Linear Stage
 Repeat ability 十/- 0.01 mm
 Accuracy +/- 0.03 mm